Thermal management is a very important consideration during the design of any portable computing system, particularly compact smartphones. Foldable display devices pack increased computing power (processors, graphic units, and high-speed memory units) into smaller and thinner form factors. In addition to managing heat dissipation for the processor, GPU, memory, and other controllers, the design of the foldable devices should also consider the effect of heat on the pixels/display area in the foldable region, which is already exposed to extra tensile forces.
U.S. Publication No. 20200204666 assigned to Samsung and titled, “Foldable Electronic Device”, describes mechanisms tackling the effect of heat at the folding region. The publication discloses a hinge design that allows for placing a heat-dissipating member at the folding region. As can be seen in the images below, the hinge design has an available air space (137a) within which a heat diffusion member (210, 211, 213) is positioned.
US Publication No. 20200204666 assigned to Samsung
While Samsung’s design is focused on dissipating heat at the folding region, LG’s design as disclosed in U.S. patent publication No. 20200194712, titled “Heat Radiation Member for Flexible Display and Electronic Device Using the Same” is focused on a more integrated approach. The design includes a heat radiator (11) which includes a heat radiation sheet (11a), a cushion sheet (11b), and an adhesion layer (11c) at multiple positions on the display module, thus addressing the heat across the entire display area.
US Publication Number 20200194712 assigned to LG Display