KT Imaging USA (KT), a Texas-based entity has asserted its patents against Samsung Electronics, LG Electronics, Dynabook, HP, ACER and ASUSTeK. 

In its complaint filed in the Eastern and Western Texas District Courts, KT alleges that the Defendant electronic manufacturers willfully infringed on its patents. The alleged infringing products include front or rear facing image sensors incorporated in devices such as tablets, notebooks and smartphones. KT is represented by The Stafford Davis Firm and Kheyfits Belenky.

The recently filed multiple suits are similar in nature to earlier cases KT Imaging filed against Kyocera, Lightcomm Technology and Panasonic in 2019. The Kyocera and Panasonic cases were terminated earlier, likely the result of settlements, while the litigation against Lightcomm Technology is still pending.

The patents-in-suit are US Patent Nos: 6,590,269; 6,876,544; 7,196,322; 7,511,261; 8,004,602; and 8,314,481. They were acquired by KT from Kingpak Technology in December of 2018. Kingpak Technology, formerly known as International Branding Marketing, is a Taiwan-based distributor of flashcards, dynamic random access memory (DRAM) modules and integrated circuit (IC) products.

US Patent No. 6,590,269 relates to a package structure for a photosensitive chip within a cavity formed between a substrate and a frame layer. The frame layer is formed on the substrate by way of injection molding. The ‘269 patent has been asserted in seven cases against LG, Samsung, Panasonic and Kyocera.

US Patent No. 6,876,544 relates to an image sensor module to be mounted to a printed circuit board that includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip, and a lens barrel formed with a chamber at a center thereof and an external thread at an outer edge thereof. The ‘544 patent has been asserted in seven cases against LG, Samsung, HP, ASUSTeK Computer, Dynabook, Panasonic and Kyocera.

US Patent No. 7,196,322 relates to an image sensor module that includes a substrate, a frame layer, a photosensitive chip, a lens holder, and a lens barrel. The substrate configuration includes an upper surface, a lower surface, a frame layer and a cavity region. The photosensitive chip is mounted on the upper surface of the substrate and located within the cavity. The ‘322 patent has been asserted in seven cases against LG, Samsung, HP, ASUSTeK Computer, Dynabook, Panasonic and Kyocera.

US Patent No. 7,511,261 acquired in December 2018 from Kingpak Technology relates to an image sensor module structure with a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate configuration includes an upper surface, a lower surface where electrodes are formed. The ‘261 patent has been asserted in two cases against LG and Samsung.

US Patent No. 8,004,602 relates to an image sensor structure with an integrated lens module. The image sensing chip has a plurality of light-sensing elements arranged around the light-sensing area and is electrically connected to the conducting pad. The ‘602 patent has been asserted in nine cases against LG, Samsung, HP, ASUSTeK Computer, Dynabook, Panasonic, Kyocera, ACER and Lightcomm Technology.

US Patent No. 8,314,481 relates to a substrate structure for an image sensor package made of a bottom base and a frame layer. The bottom base has an upper surface, a lower surface and an insulation layer interposed between the bottom base and a frame layer forming a cavity. The ‘481 patent has been asserted in eight cases against LG, Samsung, HP, ASUSTeK Computer, Dynabook, Panasonic, Kyocera, and ACER.